'Commonly used packages and advanced packages; Materials in packages' Video Lecture

Commonly used packages and advanced packages; Materials in packages

  • Course: An Introduction to Electronics Systems Packaging
  • Discipline: Electrical Engineering
  • Faculty: Prof. G.V. Mahesh
  • Institute: IISc Bangalore

    • Commonly used packages and advanced packages; Materials in packages - Click on the Video Link shown below to play the video on Youtube. Browse through An Introduction to Electronics Systems Packaging (Electrical Engineering) Video Lectures by Prof. G.V. Mahesh from IISc Bangalore through NPTEL.

    NEXT LECTURE >> Advances packages (continued); Thermal mismatch in packages; Current trends in packaging
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    Course Video Lectures Introduction and Objectives of the course Definition of a system and history of semicon.. Products and levels of packaging Packaging aspects of handheld products; Case .. Case Study (continued); Definition of PWB, su.. Basics of Semiconductor and Process flowchart.. Wafer fabrication, inspection and testing Wafer packaging; Packaging evolution; Chip co.. Wire bonding, TAB and flipchip-1 Wire bonding, TAB and flipchip-2; Tutorials Why packaging? & Single chip packages or modu.. Commonly used packages and advanced packages;.. Advances packages (continued); Thermal mismat.. Multichip modules (MCM)-types; System-in-pack.. Electrical Issues - I; Resistive Parasitic Electrical Issues - II; Capacitive and Induct.. Electrical Issues - III; Layout guidelines an.. Electrical Issues - IV; Interconnection Quick Tutorial on packages; Benefits from CAD.. Components of a CAD package and its highlight.. Design Flow considerations; Beginning a circu.. Demo and examples of layout and routing; Tech.. Review of CAD output files for PCB fabricatio.. Process flow-chart; Vias; PWB substrates Substrates continued; Video highlights; Surfa.. Photoresist and application methods; UV expos.. PWB etching; Resist stripping; Screen-printin.. Through-hole manufacture process steps; Panel.. Video highlights on manufacturing; Solder mas.. Microvia technology and Sequential build-up t.. Conventional Vs HDI technologies; Flexible ci.. SMD benefits; Design issues; Introduction to .. Reflow and Wave Soldering methods to attach S.. Solders; Wetting of solders; Flux and its pro.. Vapour phase soldering, BGA soldering and Des.. SMT failure library and Tin Whiskers Tin-lead and lead-free solders; Phase diagram.. Lead-free solder considerations; Green electr.. Thermal Design considerations in systems pack.. Introduction to embedded passives; Need for e.. Embedded capacitors; Processes for embedding .. Chapter-wise summary
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