'Microvia technology and Sequential build-up technology process flow for high-density interconnects' Video Lecture

Microvia technology and Sequential build-up technology process flow for high-density interconnects

  • Course: An Introduction to Electronics Systems Packaging
  • Discipline: Electrical Engineering
  • Faculty: Prof. G.V. Mahesh
  • Institute: IISc Bangalore

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    Course Video Lectures Introduction and Objectives of the course Definition of a system and history of semicon.. Products and levels of packaging Packaging aspects of handheld products; Case .. Case Study (continued); Definition of PWB, su.. Basics of Semiconductor and Process flowchart.. Wafer fabrication, inspection and testing Wafer packaging; Packaging evolution; Chip co.. Wire bonding, TAB and flipchip-1 Wire bonding, TAB and flipchip-2; Tutorials Why packaging? & Single chip packages or modu.. Commonly used packages and advanced packages;.. Advances packages (continued); Thermal mismat.. Multichip modules (MCM)-types; System-in-pack.. Electrical Issues - I; Resistive Parasitic Electrical Issues - II; Capacitive and Induct.. Electrical Issues - III; Layout guidelines an.. Electrical Issues - IV; Interconnection Quick Tutorial on packages; Benefits from CAD.. Components of a CAD package and its highlight.. Design Flow considerations; Beginning a circu.. Demo and examples of layout and routing; Tech.. Review of CAD output files for PCB fabricatio.. Process flow-chart; Vias; PWB substrates Substrates continued; Video highlights; Surfa.. Photoresist and application methods; UV expos.. PWB etching; Resist stripping; Screen-printin.. Through-hole manufacture process steps; Panel.. Video highlights on manufacturing; Solder mas.. Microvia technology and Sequential build-up t.. Conventional Vs HDI technologies; Flexible ci.. SMD benefits; Design issues; Introduction to .. Reflow and Wave Soldering methods to attach S.. Solders; Wetting of solders; Flux and its pro.. Vapour phase soldering, BGA soldering and Des.. SMT failure library and Tin Whiskers Tin-lead and lead-free solders; Phase diagram.. Lead-free solder considerations; Green electr.. Thermal Design considerations in systems pack.. Introduction to embedded passives; Need for e.. Embedded capacitors; Processes for embedding .. Chapter-wise summary
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